System-in-Package
(SiP) Die Technologies Market Gowth Drivers Analysis by 2019
System in a Package (SiP) technology created multiple enhanced
packaging applications to develop solutions that are capable of being
customized depending on the requirement of the user. SiP is a
combination of several integrated circuits (ICs) combined in a single
module or package. System in a Package gives tangible gains when
space reduction is considered. Although system-on-chip (SoC) fulfills
the same objective further effectively, their designs are more time
consuming and complex than system in a package. SiP\'s simplicity has
unbolted a wide collection of uses for it in not less than 10 years
since its origin. ICs in System in package are interconnected to each
other to form a single integrated unit. Wire bond technology and flip
chip technology are the two main technologies used to interconnect
the chips in system in a package.
Low cost of ownership is one of the major driving forces for the
system-in-a-package market. Other factors driving the market growth
include low cost required for development higher levels of
integration, increased functionality with smaller size (as compared
to separately packaged ICs) and better flexibility in product
development. Also, rising demand for high performance and
miniaturized electronic devices and high penetration in consumer
electronics segment is expected to drive the systems in a package
market. However, factors such as limited availability of resources
and skills, re-alignment of electronic decision automation (EDA)
processes and lack of known good die (KGD) are hampering the growth
of the system in package market.
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The system in package market is segmented on the basis of
applications into consumer electronics sector, communications sector,
automotive & transportation sector, industrial sector, military,
defense & aerospace (MDA) and medical sector among others. On the
basis of end use, the market is segmented into RF wireless modules,
high power communication devices, power amplifiers, led packages,
servers, high density single module computers, portable electronics,
space and military avionics and wearable computers. In addition, the
systems in a package market is segmented on the basis of packaging
technology into 3D IC packaging, 2.5D IC packaging and 2D IC
packaging technology. The packaged chips or bare die are horizontally
tiled in 2.5D or 2D technology; the only difference lies in the 2.5D
IC. A silicon interposer is placed between the substrate and die in
2.5D IC while in 3D IC packaging, the packaged IC or the bare die are
mounded vertically to form SiP.
Furthermore, the system in a package market is segmented on the basis
of packaging type into BGA (ball grid array), pin grid array (PGA),
surface mount package, small outline package (SOP) and flat package.
Ball grid array is further sub-segmented into plastic ball grid array
(PBGA), small ball grid array (SBGA), flip chip molded ball grid
array (FCBGA) and fine ball grid array (FBGA). PGA is further sub
segmented into flip chip molded pin grid array (FCPGA) and ceramic
pin grid array (CPGA). Flat packages comprise of quad flat no leads
(QFN) and ultra thin quad flat no leads (UTQFN) and small outline
packages sub divisions are thin small outline packages (TSOP) and
thin shrink small outline packages (TSSOP).
Some of the key players in the systems in a package market include
Amkor Technology Inc., Chipmos Tech. Inc, ASE Inc., Chipbond
Technology Corporation, GS Nanotech, Fujitsu Ltd., Insight SIP,
Nanium S.A., Jiangsu Changjiang Electronics Technology Co. Ltd,
Qualcomm Incorporated, Powertech Technologies Inc., Stats Chippac
Ltd., Siliconware Precision Industries Co. Ltd., WI2WI Corporation
and Toshiba Corporation among others.
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